Product Applications

• 24-fiber high-density multimode interconnection in data centers, meeting short-to-medium-distance transmission needs over 850nm/1300nm dual wavelengths and supporting large-scale high-bandwidth signal interconnection between devices

• Precision cabling scenarios for multi-channel high-density signal transmission in enterprise mega data centers, high-performance computing clusters, and multimedia systems

• Systems with stringent requirements for fiber density and transmission stability, such as campus networks and smart building applications

Product Standards

• Compliant with the multimode OM3 fiber industry standard (TIA/EIA-568-C.3)
• Plenum (OFNP) outer jacket meets UL 910 flame-retardant standard, suitable for cabling in special environments such as air-handling plenums

Product Features

• Dual-ended design with US Conec MTP® Elite female connectors (pinless), delivering 24-fiber ultra-high-density interconnection optimized for large-scale high-bandwidth multimode scenarios

• Corning ClearCurve® multimode fiber (OM3 50/125μm) supports transmission over 850nm/1300nm dual wavelengths, with attenuation ≤2.3dB/km at 850nm and ≤0.6dB/km at 1300nm, ensuring signal quality over short-to-medium distances

• UPC to UPC polish type with return loss ≥20dB and insertion loss of 0.35dB delivers excellent signal transmission accuracy and stability

• Plenum (OFNP) flame-retardant outer jacket with minimum bend radius of only 7.5mm (fiber) and 20D dynamic/10D static (patch cord), adapting to complex cabling environments

• Connector durability of 500 matings, tensile strength 80N long-term and 240N short-term, reliable mechanical performance with a wider temperature range (operating -10~70℃, storage -40~85℃)

Structural Parameters

Delivery Length

Lengths can be customized according to actual device interconnection distance requirements, covering a variety of application scenarios from short to long distances.