Product Applications

• Conversion and interconnection between high-density multimode fiber (MTP-16) and universal duplex LC interfaces in data centers, meeting short-to-medium-distance transmission needs over 850nm/1300nm dual wavelengths and supporting high-bandwidth device interface compatibility and signal transmission

• Scenarios requiring multi-channel signal transmission and flexible interface adaptation, such as enterprise high-performance computing clusters, multimedia systems, and security surveillance

• Systems requiring fiber density and cabling compatibility, such as campus networks and smart building applications

Product Standards

• Compliant with the multimode OM4 fiber industry standard (TIA/EIA-568-C.3)
• Plenum (OFNP) outer jacket meets UL 910 flame-retardant standard, suitable for cabling in special environments such as air-handling plenums

Product Features

• Combines US Conec MTP®-16 female (pinless, offset key) and duplex LC connectors for flexible conversion from high-density MTP-16 interfaces to universal LC interfaces, meeting the adaptation needs of multi-fiber and duplex interfaces

• Corning ClearCurve® multimode fiber (OM4 50/125μm) supports transmission over 850nm/1300nm dual wavelengths, with attenuation ≤2.3dB/km at 850nm and ≤0.6dB/km at 1300nm, ensuring signal quality over short-to-medium distances

• APC to UPC polish type: MTP connector insertion loss ≤0.35dB (typical 0.15dB) and return loss ≥20dB; LC connector insertion loss ≤0.2dB and return loss ≥30dB, delivering excellent signal transmission accuracy and stability

• Plenum (OFNP) flame-retardant outer jacket with minimum bend radius of 7.5mm; breakout cable diameter 2.0mm and breakout length 0.5m, adapting to installation needs in complex cabling environments and interface conversion scenarios

• Reliable mechanical performance: 80N long-term and 240N short-term tensile load, ensuring structural stability during cabling and service

Structural Parameters

Delivery Length

Lengths can be customized according to actual device interconnection distance requirements, covering a variety of application scenarios from short to long distances.