• 1600Gbps ultra-high-speed network device interconnection scenarios, suiting large-scale high-speed signal transmission needs between OSFP (with heatsink) interface devices
• Short-distance cabling scenarios between devices with extremely high data rate requirements, such as mega data center core layers and high-performance computing clusters
• Ultra-high-speed network systems with stringent requirements on transmission bandwidth, cabling density and stability
• OSFP (with heatsink) to OSFP (with heatsink) form factor design, supports a maximum data rate of 1600Gbps, meeting ultra-high-speed data transmission needs
• 27AWG copper cable of passive DAC type with PAM4 modulation, ensuring stability and reliability of ultra-high-speed signal transmission
• PET outer jacket material with a minimum bend radius of 60mm, suitable for complex cabling environments
• Power consumption ≤0.1W, energy-efficient and stable; commercial temperature range 0~70°C, meeting common commercial temperature requirements
| Specifications | |||
|---|---|---|---|
| Product Model | OSFP-1.6T-PC01 | Brand | YATAI |
| Form Factor | OSFP (with heatsink) to OSFP (with heatsink) | Max Data Rate | 1600Gbps |
| Cable Type (Copper) | Copper Cable | Cable Type (Passive DAC) | Passive DAC |
| Cable Length | 1m (3ft) | Wire Gauge | 27AWG |
| Min. Bend Radius | 60mm | Power Consumption | ≤0.1W |
| Jacket Material | PET | Commercial Temperature Range | 0 to 70°C (32 to 158°F) |
| Supported Protocols | IEEE 802.3, OSFP MSA | Modulation | PAM4 |
Delivery Standards
Can be shipped as a single item or delivered as a set; contact customer service for details.